RRP Electronics Partners with AMB for $25 Million Semiconductor Production

RRP Electronics Limited has signed an MoU with AMB, Taiwan to enhance production of memory modules, projected to generate $25 million annually. The collaboration will see immediate implementation at RRP's OSAT facility, supplying to major corporates like Samsung, with further expansion planned at a new Taloja plant.

Mumbai, November 14, 2024: RRP Electronics Limited, a leader in semiconductor technology, has inked a Memorandum of Understanding (MoU) with Taiwan's AMB. This collaboration focuses on the complete technology agreement for memory modules such as SPI NAND, MICROSD, EMMC, and SSD, initially valued at $25 million.

The technology agreement extends from 2GB upwards, covering comprehensive package structures, substrate designs, and test program development, alongside supporting tool design. This strategic alliance is set to boost production, with components being supplied to industry giants like Samsung.

According to Rajendra Chodankar, Chairman of RRP Electronics, the partnership will be deployed immediately at their OSAT facility in Mahape, promising an annual revenue of $25 million. The company anticipates further growth with additional production lines at a new plant in MIDC, Taloja, expected to be operational within two years.

(With inputs from agencies.)